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© 2006 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and distribu-
tion is a violation of law.
ORDER NO. KM40610225CE
Telephone Equipment
KX-TG1070HGB
KX-TGA107EXB
Digital Cordless Phone
Black Version
(for Hungary)
2
KX-TG1070HGB/KX-TGA107EXB
3
KX-TG1070HGB/KX-TGA107EXB
TABLE OF CONTENTS
PAGE
1 Safety Precaution ------------------------------------------------ 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (Pbf: Pb free)--------------- 4
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7
4.1. Block Diagram (Base Unit) ------------------------------ 7
4.2. Circuit Operation (Base Unit)--------------------------- 8
4.3. Block Diagram (Handset)-------------------------------- 9
4.4. Circuit Operation (Handset)----------------------------10
4.5. Signal Flow-------------------------------------------------11
5 Location of Controls and Components ------------------12
5.1. Controls -----------------------------------------------------12
6 Installation Instructions ---------------------------------------12
6.1. Connections------------------------------------------------12
6.2. Battery-------------------------------------------------------13
7 Operation Instructions-----------------------------------------14
7.1. Guide to Telephone Settings---------------------------14
7.2. Handset Registration ------------------------------------14
7.3. For Service Hint-------------------------------------------14
8 Service Mode -----------------------------------------------------15
8.1. Engineering Mode ----------------------------------------15
8.2. How to Clear User Setting------------------------------19
8.3. How to Set When Replacing Unit---------------------20
9 Troubleshooting Guide ----------------------------------------21
9.1. How to Replace the Flat Package IC----------------22
10 Disassembly and Assembly Instructions ---------------24
10.1. Disassembly Instructions -------------------------------24
11 Schematic Diagram ---------------------------------------------26
11.1. For Schematic Diagram---------------------------------26
11.2. Schematic Diagram (Base Unit_Main) --------------27
11.3. Schematic Diagram (Base Unit_Operation) -------30
11.4. Schematic Diagram (Handset) ------------------------31
12 Printed Circuit Board-------------------------------------------35
12.1. Circuit Board (Base Unit) -------------------------------35
12.2. Circuit Board (Base Unit_Page key) -----------------37
12.3. Circuit Board (Handset)---------------------------------39
13 Exploded View and Replacement Parts List -----------41
4
KX-TG1070HGB/KX-TGA107EXB
1 Safety Precautions
1.1. For Service Technicians
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic parts boxes with aluminum foil and ground them.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
2Warning
2.1. Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
2.2. About Lead Free Solder (Pbf: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).
Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
5
KX-TG1070HGB/KX-TGA107EXB
2.2.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’s
specific instructions for the melting points of their products and any precautions for using their product with other materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.2.2. How to Recognize that Pb Free Solder is Used
(Example: Handset P.C.B.)
(Component View)
Note:
The location of the “PbF” mark is subject to change without notice.
U4
RF
U3
> EP-GW <
PbF
35-006057-005-200
Marked
6
KX-TG1070HGB/KX-TGA107EXB
3 Specifications
Note:
Specifications are subject to change.
Note for Service:
Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
Analog telephone connection: Telephone Line
7
KX-TG1070HGB/KX-TGA107EXB
4 Technical Descriptions
4.1. Block Diagram (Base Unit)
ANT
RF Module
EEPROM
U3
U2
Crystal
3.3V
3.3V
37
6
14
4
15
Q605
R-DATA
T-DATA
D1~ D4, Q7
32
64
17, 18 50, 51
2, 52
DC
6V
Charge Contact
13.824MHz
Linear
Regulator
U1
Current
Limiter
Power
DC6V
Base
Band
Controller
Speech
Network
TEL Line
Interface
Tel Line
Locator button
KX-TG1070 BLOCK DIAGRAM (BASE UNIT)
8
KX-TG1070HGB/KX-TGA107EXB
4.2. Circuit Operation (Base Unit)
The base-station consists of base band controller, speech network, tel-line interface, RF module, linear regulator, EEPROM,
crystal and so on. Refer to Block Diagram (Base Unit) (P.7).
4.2.1. Base Band Controller
These are parts to control all function of the base-station, we used the Philips XS which is controller for DECT. These devices
include all control circuits of the base-station for RF module, tel-line interface, ADPCM codec, series regulator and so on.
4.2.2. Power Supply
The power supply consists with CM1117 voltage regulator ICs.
CM1117 generate DC 3.3V voltage from DC 6V voltage from adaptor. DC 3.3V are used for RF module & I/O port, DC 2.5V &
DC1.8V are used for the base band controller and the circumference circuits.
4.2.3. Speech Network
The TR circuit is used for speech network. The function of this connects tel-line interface and the base band controller.
4.2.4. TEL Line Interface
The function of this connects tel-line and speech network. Also, the tel-line interface include the ring detect circuit, caller-ID cir-
cuit.
4.2.5. EEPROM
This is 8K bits memory. The each kind of value to set-up at power-on, redial memory, speed-dialing memory, and so on are
stored in this device.
4.2.6. RF Module
Receiver part: RF signals induced at the antenna are extracted by the RF control interface. The RF signal to be selected is
demodulated into RX_DATA signals. And signals is passed to the base band controller.
Transmitter part: The signal from transceiver chip-set is fed to the antenna through the RF power amplifier by control of the RF
control interface. And then this signal is radiated from antenna.
Logical part: The frequency to be used is generated in transceiver chip-set by control signals (CLK, DATA, ENABLE, SYRI) of
the RF control interface.
4.2.7. Current Limiter
The current limiter is circuit to supply the proper current to charge batteries of the handset from DC 6V voltage.
9
KX-TG1070HGB/KX-TGA107EXB
4.3. Block Diagram (Handset)
Antenna
RF Module
2.4V, 2-cell
Switching
Regulator
Charger
Charger Contact
Crystal
13.824MHz
Battery
EEPROM
U3
U4
Base Band
Controller
LCD Driver
U2
LCD
KEYPAD
Ear Piece
MIC
KX-TGA107 BLOCK DIAGRAM (HANDSET)
6
14
4
15
2
52
16, 17
50, 51
32, 33
29, 30
54, 55, 56
57~62, 64, 1
R-DATA
T-DATA
Q10
10
KX-TG1070HGB/KX-TGA107EXB
4.4. Circuit Operation (Handset)
The handset consists of Base Band Controller, LCD, RF module, keypad, regulator, charger, EEPROM, crystal, earpiece, ringer
& microphone, and so on.
4.4.1. Base Band Controller
The base band controller controls all function of the handset, Philips XS for the base band controller is used.
This device include all control circuits of the handset for RF module, LCD controller, keypad interface, earpiece, microphone,
ADPCM codec, switching and series regulator and so on.
4.4.2. Charger
The base-station supply DC 6V power to the charger and the charger charges the batteries to use this power. The signal on the
charger circuit is generated when the handset is to being charged this signal is used to control the charger circuit and for auto-
matic off-hook by cradle-off when an incoming call is coming.
4.4.3. 2.4V 2 cell & 3.3V output from internal switching regulator
The battery is (2.4V / 2cell) directly supplied to switching regulator which controlling by base band controller and step up the DC
3.3V to the RF module & I/O port. DC 2.5V & DC1.8V are used for the base band and the circumference circuits.
4.4.4. RF Module
Receiver part: RF signals induced at the antenna are extracted by the RF control interface. The RF signal to be selected is
demodulated into RX_DATA signals. And signals is passed to the base band controller.
Transmitter part: The signal from transceiver chip-set is fed to the antenna through the RF power amplifier by control of the RF
control interface. And then this signal is radiated from antenna.
Logical part: The frequency to be used is generated in transceiver chip-set by control signals (CLK, DATA, ENABLE, SYRI) of
the RF control interface.
4.4.5. LCD
The LCD consists of 7-segment, 12 digit display and 13 icon which controlling by the LCD display driver.
4.4.6. Keypad
The keypad consists of 12 dialing keys and 8 function keys.
11
KX-TG1070HGB/KX-TGA107EXB
4.5. Signal Flow
4.5.1. Talk mode:
Rx audio signal from line interface at “LINERX_P” path into B/S MCU (pin 32, 33) and then signal from B/S RF transform, H/S RF
receive signal forward to MCU, H/S MCU from (pin 32, 33) receive path output audio signal to receiver.
Tx audio signal from MIC receive audio signal at mic path into H/S MCU and then audio signal from H/S RF transform, B/S RF
receive signal forward to MCU, B/S MCU audio signal from (Pin 30, 29) at “LINETX_P” path transmit to line interface out of PSTN.
4.5.2. Ringer detect:
Telephone line have ringer signal from tip ring into Base, and then Base transistor Q8 turn on and ringer data signal for Base MCU
(Pin 58_IOGP16) detect and the handset buzzer have product “Melody tone”.
4.5.3. Type I CID receive:
CID signal from tip ring couple CID signal at (CID1_P, CID1_N) path into Base MCU (Pin 29, 30) detect, Handset display show the
telephone no.
12
KX-TG1070HGB/KX-TGA107EXB
5 Location of Controls and
Components
5.1. Controls
5.1.1. Base Unit
5.1.2. Handset
6 Installation Instructions
6.1. Connections
Note:
Use only the included AC adaptor and telephone line cord.
Connect the AC adaptor securely to the AC outlet.
Never install telephone wiring during a lightning storm.
Do not connect the AC adaptor to a ceiling-mounted AC out-
let, as the weight of the adaptor may cause it to become dis-
connected.
Location
• For maximum distance and noise-free operation, place your
base unit:
- Away from electrical appliances such as TVs, radios,
personal computers or other phones.
- In a convenient, high and central location.
13
KX-TG1070HGB/KX-TGA107EXB
6.2. Battery
6.2.1. Battery Installation
Note:
• Use only the included rechargeable batteries HHR-55AAAB
or HHR-4EPT.
6.2.2. Battery Charge
6.2.3. Battery Strength
6.2.4. Panasonic Ni-MH Battery
Performance
Note:
• It takes 10 hours to fully charge the batteries, however, you
can use the handset if remains on the display while
charging.
It is normal for batteries not to reach full capacity at the initial
charge. Maximum battery performance is reached after a
few complete cycles of charge/discharge (use).
Actual battery performance depends on a combination of
how often the handset is in use and how often it is not in use
(standby).
• Even after the handset is fully charged, the handset can be
left on the base unit without any ill effect on the batteries.
The battery strength may not be displayed correctly after you
replace the batteries. In this case, place the handset on the
base unit and charge for at least 10 hours.
14
KX-TG1070HGB/KX-TGA107EXB
7 Operation Instructions
7.1. Guide to Telephone Settings
7.2. Handset Registration
7.3. For Service Hint
15
KX-TG1070HGB/KX-TGA107EXB
8 Service Mode
8.1. Engineering Mode
8.1.1. Base Unit
16
KX-TG1070HGB/KX-TGA107EXB
Note:
(*1) Refer to Handset Registration (P.14).
(*2) When you enter the address or New Data, please refer to the table below.
Desired Number (hex.) Input Keys Desired Number (hex.) Input Keys
00 A
[] + 1
11 B
[] + 2
.. C
[] + 3
.. D
[] + 4
.. E
[] + 5
99 F
[] + 6
17
KX-TG1070HGB/KX-TGA107EXB
8.1.2. Handset
18
KX-TG1070HGB/KX-TGA107EXB
Note:
(*1) When you enter the address or New Data, please refer to the table below.
Desired Number (hex.) Input Keys Desired Number (hex.) Input Keys
00 A
[] + 1
11 B
[] + 2
.. C
[] + 3
.. D
[] + 4
.. E
[] + 5
99 F
[] + 6
19
KX-TG1070HGB/KX-TGA107EXB
8.2. How to Clear User Setting
20
KX-TG1070HGB/KX-TGA107EXB
8.3. How to Set When Replacing Unit
If base unit or handset has a defect, replace with new base unit or handset. Refer to the following procedures.
Note:
BS=Base unit, HS=Handset
To register handset, refer to Handset Registration (P.14)
21
KX-TG1070HGB/KX-TGA107EXB
9 Troubleshooting Guide
If your telephone does not work properly, try to solve the problem according to the following table.
Note:
(*1) Refer to Handset Registration (P.14).
22
KX-TG1070HGB/KX-TGA107EXB
9.1. How to Replace the Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
9.1.1. Preparation
PbF (: Pb free) Solder
Soldering Iron
Tip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
•Flux
Recommended Flux: Specific Gravity 0.82.
Type RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (Pbf: Pb free) (P.4)
9.1.2. How to Remove the IC
1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.
23
KX-TG1070HGB/KX-TGA107EXB
9.1.3. How to Install the IC
1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
9.1.4. How to Remove a Solder Bridge
1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
24
KX-TG1070HGB/KX-TGA107EXB
10 Disassembly and Assembly Instructions
10.1. Disassembly Instructions
10.1.1. Base Unit
25
KX-TG1070HGB/KX-TGA107EXB
10.1.2. Handset
26
KX-TG1070HGB/KX-TGA107EXB
11 Schematic Diagram
11.1. For Schematic Diagram
11.1.1. Base Unit (Schematic Diagram (Base Unit_Main))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. The schematic diagrams may be modified at any time with the development of new technology.
11.1.2. Handset (Schematic Diagram (Handset))
Notes:
1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.
2. The schematic diagrams may be modified at any time with the development of new technology.
27
KX-TG1070HGB/KX-TGA107EXB
11.2. Schematic Diagram (Base Unit_Main)
RX
TX
TP51
R20
EBR
TB
TB
Earth Break
Line Selection
Line Protection
Path Selection
Chain Relay
MBR Reduction
Wetting Pulse
AC / DC Load
Surge Protection
Pulse Shape
Complex Load
600R Load
DC Line Loading
Sidetone Concellation
Parallel Phone Detection
Current
Limitation
TX Amplifier
RLR & SLR
Line Reversal Detection
Toll Count
Filter
GND
ESD
L7
10uH
L4
++
I
+
+
+
I
I
+
+
I
+
I
+
+
+
I
+
I
I
I
10uH
Q28
C29
C30
1N
C25
C33
C36
C37
C129
100n
TP54
TP52
100n
R30
R691
6V_UNREG
BPHONE_RLY
REV1_MBR
ACDC_LOAD
PARA_DET
R84
R10
R11
C6
C70
C71
C661
8p2
8p2
8p2
8p2
Q604
Q605
R642
R639
TP66
C665
TP65
TP63
R52
R13
R17
TBR38 / 600
R58
R63
R64
TP75
TP78
VDD3V2
R24
C18
R38
Q1
R21
C21
C10
TP79
R96
C11
C12
Q5
TP77
R8
TP76
C24
C22
R23
R22
C23
100N
TP6
TP72
R648
C670
C669
C85
6N8
8p2
15K
R646
R647
2K2
TP73
TP71
TP74
R6
10N
C666
R638
R637
220K
C1
100N
8p2
LINERX_P
LINETX_P
LINETX_P
100N
C668
C688
TP59
R12
R83
R69
R9
C657
C663
R640
VDD3V2
R14
R15
TP61
Q2
Q4
R16
TP62
TP67
R636
C659
C89
R631
C69
TP60
8p2
C656
D610
47V
1.3W
2n2
4k7
EC658
10uF
50V
8P2
R632
C38
C693
C8
1k
R635
TP69
TP70
D606
1/2W
C662
68N
50V
68K
C35
TO-92
TP68
100K
R633
8p2
8p2
R36
R32
R29
R644
8p2
8p2
TP49
Q3
N.C
B
E
C
TP24
LINE
+ 2
REV2_WP
LINE + 1
R62
R87
C57
R89
C58
R88
Q24
R690
390k
GND
GND
D3
D4
GND
GND
1N
C192
GND
GND
GND
GND
GND
OR
R90
R91R85
OROR
GND
GND
GND
VDD3V2
VDD3V2
R55
REV1_MBR
REV2_WP
Q14
R54
R53
TIP
C2
R5
R56
R57
Q15
C3
RING
GND
GND GND
GND
GND
GND
GND
GND GND
GND GND
GND
GND
GND
GND
GND
GND GND
GND
GND
GND
GND
GND
GND
GND
GND
GND GND GND
GND
OFF_HOOK
R33
390k
R31
18k
C19
Q8
GND
10n
R39
VDD3V2
RING_DET
10k
C31
10N / 250V
R678
RL1-C
R76 TB
R79 TB
R78 TB
R75 TB
R682
R665
6
1
2
3
4
2
4
3
7
5
TB
D2
D1
TB
VAR1
RING
CID1_N
PJ1
TB
TB
TB
TB
TB
TB
TB
D603
TB
R19
TB
R18
TB
GND
GND
GND
GND
GND
GND
GND
GND
GND
RL1-A
TB
TB
Q606
TB
1
8
D608
R659
TP55
TP56
C664
1/2W
R50
TP57
Q601
LINE+2
TB
D6
TB
Q607
TB
Q12
E
E
B
B
C
C
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
TB
R7
TB
R2
TB
R82
TB
C32
TB
R81
TB
R97
R104
R102
R103
3K3
TP58
TP23
180K
2M
10M
R25
220k
C34
TP47
R26
8k2
Q6
C27
R27
2k2
2k2
R28
EC4
TP48
C28
C26
R80
TO92
Q7
Q30
C
C
B
B
E
E
Q11
R92
N.C.
N.C.
N.C.
0603
N.C
N.C
N.C
N.C
N.C
N.C
NC
N.C
N.C N.C
3n3
TB
Q10
TB
R1
TB
TB
RING
TIP
TB
R93
TB
R649
TB
EC1
TB
50V
RL1-B
TIP
TP9
TP10
Onhook
Onhook
Offhook
Offhook
0805
CID1_P
LINE+1
LINE_INUSE
10N / 250V
L1
TB
500V
Type 4
Type 4
1N
500V
For TG1090 Only
Option 1
Option 2
Option 16
Option 4
Option 11
Option 12
Option 13
Option 5
Option 6
Option 17
Option 7
Option 8
Option 9
Option 15
Option 20
Option 10
Option 19
Option 18
Option 14
Option 3
KX-TG1070HG SCHEMATIC DIAGRAM (Base Unit_Main 1/3)
N.C: No Components
28
KX-TG1070HGB/KX-TGA107EXB
RX
TX
KX-TG1070HG SCHEMATIC DIAGRAM (Base Unit_Main 2/3)
N.C: No Components
U2
BBIC
U3
C97
VDD3V2
VDD3V2
VDD3V2
VDD3V2
VDD3V2
VDD3V2
VDD2V5
VDDINT
VDDO
VDDA
VDDC1
VDDC
ATE INTERFACE
JTAG INTERFACE
VDD3V2
VDDC
VDDINT
VDDO
VDD3V2
VDDC
12P
C39
SCL
VCC
WP
A0
A1
A2
GND
1
2
3
4
5
6
7
8
SDA
SCL
BUZZER
LINE_INUSE
PARA_DET
AON2
BPHONE_RLY
TDO
TDI
TCK
TMS
SDA
DI_SPI
VSSIO4
AOP2
LINERX_P
LINETX_P
VDDA
AIP2
AIN2
VR2_CTRL
VR1_CTRL
VBGP
VSSA
VSSO
XTAL2
XTAL2
XTAL1
XTAL1
13.824MHz
XTL - AT - 49
VR2_CTRL
POWER_CHK
VR1_CTRL
ANT0_SW
ANT1_SW
RF_SIG[0]
RF_SIG[1]
VANLI
VBAT
VMIC
IOGP24 / KB9
VDDIO1
JTAG_TMS
IOGP13
IOGP14 / BIF
VDDC2
VSSC2
VSSINT
PWR_SWITCH
VR3_CTRL
AIP2B
AIN2B
AD3
AD2
AON2
JTAG_TCK
JTAG_TDI
JTAG_TDO
RF_SIG[3]
SIF_DATA
RF_SIG[2]
VSSC1
VSS
RSSI
R_DATA
T_GFSK / T-DATA
VDDO
VDDC1
VDDINT
REF_CLK
RF_SIG4 / IOGP28
SIF_CLK
VDDIO3
IOGP0 / SCL_IIC
IOGP31 / DI_SPI
IOGP32 / DO_SPI
IOGP33 / SCK_SPI
IOGP15 / KB0
IOGP16 / KB1
IPGP17 / KB2
IOGP18 / KB3
IOGP19 / KB4
IOGP20 / KB5
VSSIO1
IOGP21 / KB6
ACDC_LOAD
IOGP34 / CS_SPI
IOGP1 / SDA_IIC
DO_SPI
SCK_SPI
CS_SPI
REV2_WP
RING DET
OFF_HOOK
TBR38 / 600
EBR
REV1_MBR
PA GE
C88
100N
C132
100N
C54
100N
C53
100N
C81
100N
C123
8p2
C7
8p2
J1
1
2
64
63
62
61
60
59
58
49
17
18
19
20
23
24
25
26
27
28
29
30
31
32
21
22
12
1
2
3
13
4
14
5
15
6
16
7
8
11
10
9
47
48
33
34
35
36
37
38
39
40
41
42
43
44
45
46
50
52
53
54
56
55
57
51
C145
TP16
T_GMSK
T_ENABLE
RF_S_DATA
RF_S_EN
RF_S_CLK
SLICE_CTR
R_DATAP
RSSI
RF_CLK_REF
TP17
TP4
R61 1K
1K
R86
100N
PAGE1
Page Key
1V8 / 2V5
SCL
SDA
TP8
C61
TP5
1K
R47
1%
1K3
R46
4K7
R41
100N
C83
C72
C40
C60
TP3
TP22
TP15
TP35
C9
C84
C77
C78
C86
100N
100N
R77
2K2
TP34
TP36
TP33
TP37
C65
C63
C59
R37
100N
C194
4K7
R40
1%
C15
1N
8p2
8p2
R66
8k2
8p2
8p2
8p2
8p2
8p2
8p2
8p2
8p2
8p2
TP11
C45
100N
C190
100N
C90
100N
D5
I
TP40
+
+
+
I
+
+
TP41
EC10C79
12P
TP42
TP12
R74
R60
NC
510R
C44
12P
Q9
VDD2V5
VR1_CTRL
POWER_CHK
Power failure if VDD3V2 < 2.8V
VR2_CTRL
100U / 6V3
R42
R43
1K
Q13
47K
47K
C193
8p2
1K
D9
C93
C
B
E
TP21
TP28
TP27
TP26
TP25
TP20
TP19
TP18
100P 100P
SDA
SCL
TDO
TDI
TCK
TMS
C119
C118
+6V
100N
C144
100N
C143
12P
R51
10R
C96
C105
C103
C107
C109
C106
C108
8P2
8P2
8P2
25338
25341
8P2
8P2
8P2
C75
8P2
C94
8P2
C95
15OP
4U7
R44
10R
R45
100R
R59
R48
TP39
EC2
100U
GND
GND
VBGP
VMIC
VDDA
GND
GND
GND
GND
GND
CID1_P
CID1_N
GNDGND
C51
10P
C46
100N
10P
C50
Y1
GND
R101
R98
R99
R105
R100
OR
OR
OR
OR
OR
CID_P
CID_N
EC3
10U
6V3
GND
GNDGND
GND
GND
GND
GND
GND
GND
TP38
TP13
TP1
C41
C74
R72
20K
R73
C73
TP2
20K
100n
100n
C141
330P
C142
330P
R35
390K
R34
390K
C42
C43
C52
C82
100N
C5
100N
C47
100N
GND
GND
GND
N.C.
N.C. N.C. N.C.
N.C.
N.C.
N.C.
C4
100N
8p2
C121
C124
C99
C49
C56
2P7
100N
EEPROM
29
KX-TG1070HGB/KX-TGA107EXB
C171
1U
TP29
TP53
CRD
CRD +
J7 2
I
I
J7 1
I
1
1
6V_UNREG
GND
Charge LED
J8
GND
N.C
N.C
N.C
R107
R108
C177
C17
C13
C16
C14
C176
Q29
L3
10uH
L2
10uH
N.C
N.C
R109
27R
1/4W
N.C
C
B
E
N.C.
N.C.
N.C
HANDSET BATTERY CHARGER
Antenna part
TP31
1
1
TP32
ANT1
ANT0
OR
C169
OR
C170
100pF
C130
1pF
C87
1pF
C20
2p7
C101
TP7
TP14
ANT1
ANT
ANT0
ANT0_SW
ANT1_SW
12P 12P 12P 12P 12P
C152
2P4 2P4 2P4
C120 C153
C76
12P
C181
12P
C156
1K
R65
1K
D7
R67
NC
C55
NC
C80
22N
L10
C91 C92 C155 C154
1000U
EC61
8p2
EC62
VDD3V2
N.C
+6V
PWRJ2
GD
1
2
10U
10U
+6V
6V_UNREG
L5
L6
GD
1
2
3
PIN
PWRJ1
GND
N
OUT1
OUT2
N.C
C64
8p2
R49
3R
R71
750R
R70
470R
EC63
100U
470U
EC65
10V
+
+
+
C66
100N
C67
8p2
C126
6V_UNREG
VDD3V2
VDDPA
3V2
U1
For TG1090 Only
R4
TB
C166
TB
TB
1
3
4
5
6
7
8
2
TP46
DO_SPI
SI
SCK
RESET
CS
SO
GND
VCC
WP
DI_SPI
VDD3V2
VDD3V2
SCK_SPI
CS_SPI
Option 21
Audio Flash
U6
Flash
COB2
T_GMSK
1
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
2
3
4
5
6
7
9
10
11
12
13
14
15
16
8
R_DATAP
RF_CLK_REF
RF_S_DATA
RF_S_EN
RF_S_CLK
SLICE_CTR
RSSI
VDDPA
C48
C68
EC163
VDD3V2
T_ENABLE
C162
100N
100N
100U
8P2
RF
ANT
C148
TP30
1
4.7pF
48
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
KX-TG1070HG SCHEMATIC DIAGRAM (Base Unit_Main 3/3)
N.C: No Components
30
KX-TG1070HGB/KX-TGA107EXB
11.3. Schematic Diagram (Base Unit_Operation)
J1
KEY1
1
1
2
2
3
KX-TG1070HG SCHEMATIC DIAGRAM (Base Unit_Operation)
31
KX-TG1070HGB/KX-TGA107EXB
11.4. Schematic Diagram (Handset)
KX-TGA107 SCHEMATIC DIAGRAM (Handset_Main 1/3)
N.C: No Components
TP101
TP102
TP104
TP103
TP5
TP12
TP10
L1
D6
I
+
I
+
I
+
I
+
I
+
I
+
+
+
+
+
Q5
Q9
B
B
C
C
E
E
Q1
D4
D1
C25
100N
C72
100N
C85
NC
D3
NC
L3
27UH
L2
TP43
TP11
TP9 TP8
TP4
D5
SL5
SL6
SL7
SL8
27UH
TP105
R34
1K
R4
15K
R24
NC
R28
OR
R43
1K
R42
15K
3V3
2V5
1V4
22U
EC26
47u / 4V
EC19
200u / 4V
EC6
47u / 4V
EC2
47u / 4V
VBAT
PWR_SW
VDD3V3
VBAT
VR2_CTRL
VBAT
FIL1
Battery
Fuse Trace
VBAT
SL 1
3.5V MAX
C26
12p
Q10
B
C
E
R15
NC
R10
OR
C19
100n
R35
680R
C8
100N
C7
12P
C44
12P
C45
100N
C84
R50
R53
6k8
6k2
4U7
TP108
Q6
U2
B
C
2
VDD
OUT
GND
NC
NC
1
3
5
4
E
R44
TP7
10R
C9
100N
R47
30K
1%
R46
18K
1%
R45
100R
R7
10R
C87
1N
C17
1N
Z1
R26
10K
R27
430R
SL 2
SL 3
SL 4
CHARGE_CTRL / CRAD_DET
ESD_TEETH / 5637
ESD_TEETH / 5637
CHARGE CONTACTS
ESD_TEETH / 5637
ESD1
ESD3
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
1
1
1
ESD_TEETH / 5637
ESD4
ESD2
VR1_CTRL
VDDC
VDD2V5
VDD2V5
VDDA
2V5
VBAT
BAT_CHK
Power failure if VBAT < 2V
VDDO
VDDINT
VBAT
32
KX-TG1070HGB/KX-TGA107EXB
RX
TX
OPTION FOR TG1090 ONLY
U3
U4
BBIC
U6 (MIC)
U7
U1
EEPROM
VDD3V3
C39
100N
TP109
C76
12P
TP112
TP113
TP114
TP115
TP116
TP117
TP118
TP21
TP27
TP119
TP120
TP121
TP123
TP124
GND
12P
C15
12P
C78
12P
C81
12P
C79
12P
R16
1K
C80
C33
100N
100N
C36
100N
C54
100N
TP130
TP1
TP6
TP129
TP132
TP134
TP136
TP131
TP133
TP128
C50
10P
C52
100N
C67
NC
C66
NC
C70
12p
C4
12p
C2
10N
C82
NC
C83
12P
C28
NC
C75
TP135
NC
Z3
NC
I
I
+
+
+
+
Z2
NC
C73
N.C
C41
22N
C43
12P
C1
10N
C74
N.C
C90
12P
C89
100N
C3
12P
C21
47U / 4V
TANT
TC5
1K2
TP29
TP15
TP3
R1
1K2
R2
100N
R14
62K
C5
NC
C63
100N
C91
4U7
C64
100N
C51
10P
R12
N.C.
C42
12P
C29
12P
C53
330N
C27
12P
C57
12P
C58
12P
C59
12P
EC1
SPK1
SPK2
10u /16V
C56
100N
C71
NC
C30
330N
C20
OR
C22
1U
R13
N.C
R3
N.C
C65
12P
C55
1N
R19
4K7
C62
NC
R22
47K
TP142
R23
N.C
R21
TP137
TP138
TP140
TP141
TP139
TP143
OR
R39
OR
R11
1K
Y1
13.824MHz
TP16
C46
C16 C18 C20 C24 C37 C38 C40
12P 12P 12P 12P 12P 12P 12P
TP26
TP25
TP24
TP23
TP20
TP18
ATE INTERFACE
JTAG INTERFACE
TP19
C77
R62 NC
R61 OR
12P
R40
1K
R41
1K
C35
100N
TP156
TP110
TP111
TP127
C31
12P
C23
12P
C34 C47
12P 100N
C32
12P
C61
NC
C60
NC
R33
OR
R32
OR
12P
C11
C12
12P
C6
12P
C49
NC
REC
TP126
TP125
TP13
TP14
R5
OR
R30
OR
R60 NC
R56 OR
C48
100N
SCL
SDA
SCL
SDA
SCL
SDA
VCC
WP
A2
GND
1
2
3
4
8
7
6
5
A0
A1
VDD3V3
VDD3V3
VDD3V3
VDDC
VDDO
VDDINT
GND
GND
GND
GND
GND
GND
GND GND
GND GND
GND
GND
REC+ / SPK_AMP+
REC / SPK_AMP
I
I
REC+ / SPK_AMP+
REC / SPK_AMP
I
I
GND GND
GND
1
2
GND
GND
GND
GND GND GND
GNDGNDGND
CD
FC2
FC1
VIN
VCC
GND
VO2
VO1
1
2
3
4
8
7
6
5
GND
GND
GND
GND
GND GND
GND
GND
GND
GND
GND
GND
GND
KBIO9
TDO
TDI
TCK
TMS
VBAT
SDA
SCL
CHARGE_CTRL / CRAD_DET
LCD_CS / TCOM_BL
LCD_SCL
LCD_SI
49
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
17
18
VSSIO1
IOGP0 / SCL_IIC
LCD_BL
TDD
TDI
TCK
TMS
AMP_EN / BEEP
AOP2
VR2_CTRL
HANDFREE_BL
VMIC
VR1_CTRL
VDD3V3
T_GMSK
AMP_EN / BEEP
BAT_CHK
VDDA
AIP2
AIN2
VR2_CTRL
VANLI
VBAT
VMIC
VR1_CTRL
VBGP
VSSA
RF_SIG [0]
RF_SIG [1]
VSSO
XTAL2
XTAL1
R_DATAP
RSSI
RF_CLK_REF
T_ENABLE
RF_S_DATA
RF_S_EN
RF_S_CLK
SLC_CTR
IOGP1 / SDA_IIC
VDDIO3
VDDIO4
IOGP24 / KB9
IOGP13
IOGP14 / BIF
VDDIO1
JTAG_TMS
JTAG_TCK
JTAG_TDI
JTAG_TDO
RF_SIG4 / IOGP28
SIF_CLK
RF_SIG [3]
SIF_DATA
RF_SIG [2]
VSSC1
VDDC1
VDDINT
VSSC2
VDDC2
VSSINT
VR3_CTRL
PWR_SWITCH
AIP2B
AIN2B
AD3
AON2
AD2
REF_CLK
VSS
RSSI
R_DATA
T_GFSK / T-DATA
VDDO
IOGP31 / DI_SPI
IOGP32 / DO_SPI
IOGP33 / SCK_SPI
IOGP34 / CS_SPI
IOGP15 / KB0
IOGP16 / KB1
IOGP17 / KB2
IOGP18 / KB3
IOGP19 / KB4
IOGP20 / KB5
IOGP21 / KB6
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
KBIO0
KBIO1
KBIO2
KBIO3
KBIO4
KBIO5
KBIO6
VDD3V3VDD3V3
VDDC
PWR_SW
VDDA
VMIC
KX-TGA107 SCHEMATIC DIAGRAM (Handset_Main 2/3)
N.C: No Components
33
KX-TG1070HGB/KX-TGA107EXB
LCD INTERFACE ( 3V2 )
TRIANGLE KEYPAD ( 28 keys max )
Key Assignment
RF
7 - Segment LCD
C
K13
K20
Off - H
On - H
PWR
PB Down
Up
OK
K21
K27
K5
K4
K3
K1 K7
K19 K10
K12 K16
K11 K15
K6
K25
K24
K23
K22
12
3
4
5
6
7
8
9
0
#
R
COB1
48
GND
GND
GND
GND
GND
T_GMSK
GND
R_DATAP
RF_CLK_REF
RF_S_DATA
RF_S_EN
RF_S_CLK
SLC_CTR
RSSI
T_ENABLE
GND
GND
VBAT
EC8
R31
2R
+
+
12P
C68
C69
100N
220u / 4V
EC4
47u / 4V
C13
100N
C14
12P
GND
GND
VDD3V3
VDD3V3
KBIO0
KBIO1
KBIO2
KBIO3
KBIO4
KBIO5
KBIO6
KBIO9
VDD3V3
Down
K19
K27
Right dot / M
K13
Left dot / C
K12
# 5
K20
SPK
K22
*
K21
RD
K6K5K4K3K2K1
TCOM# 2# 3# 0
UpPhone
K23
# 7
K25
# 1
K24
# 4
K7
#
K15
# 9
K16
# 6
K11
# 8
K10
OFF
LCD_CS / TCOM_BL
LCD_SCL
LCD_SI
1
1
1
1
1
1
BUZ1
C88
C157
12P
I
+
+
4U7
R94
2R2
R54
R52
1M
R49
100K
NC
R110
27R
D10
Q8
R95
100K
C147
12P
R48
470R
TP154
TP36
TP38
TP39
TP40
TP42
TP44
TP155
Q20
B
C
E
1
2
G
S
D
AMP_EN / BEEP
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
32
ANT1
C10
TP2
OP75
R58
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
VDDA
KX-TGA107 SCHEMATIC DIAGRAM (Handset_Main 3/3)
34
KX-TG1070HGB/KX-TGA107EXB
Memo
35
KX-TG1070HGB/KX-TGA107EXB
12 Printed Circuit Board
12.1. Circuit Board (Base Unit)
12.1.1. Component View
KX-TG1070 CIRCUIT BOARD (Base Unit (Component View))
C45
C44
C30
C29
C2
C119
C118
C57
C3
C662
C69
C90
U3
U6
Y1
C154
C155
C152
C148
C30
C87
ANT1
C120
C153
C92
C91
C76
C19
C129
C79
C83
R65
R50
R33
R31
R62
R90
R69
R4
R45
R51
R41
R40
R89
R57
R93
R54
R43
R42
R48
R74
R60
R109
EC163
EC4
EC10
COB2
EC3
EC1
EC63
EC65
EC61
EC2
L10
TP7
L1
J7
J8
J1
L4
L7
L6
TP14
ANT0
RF
TP54
12
21
TP52
TP40
TP42
TP41
TP49
TP60
TP63
TP46
TP59
TP39
D4
RL1
VAR1
PWRJ1
PJ1
PWRJ2
D3
D1
Q11
Q13
Q9
Q14
Q8
Q12
Q605
Q2
Q3
Q607
Q15
Q24
BUZ1
PbF
35-006055-003-200
>EP-GW<
C169
C181
C156
D7
C55
C80
C170
C101
C20
C97
C54
C99
C71
C93
EC658
C663
C657
C144
C166
C143
C89
C61
C88
C664
C58
R67
R649
R99
R88
R87
R56
R636
R44
R101
R98
R105
R91
R85
R12
R640
R17
R9
R83
R53
R59
L3
L2
L5
D610
D606
D9
D5
D2
36
KX-TG1070HGB/KX-TGA107EXB
12.1.2. Flow Solder Side View
C56
C49
C70
R100
TP30
TP32
TP21
TP20
TP19
TP28
TP27
TP26
TP4
TP23
TP1
TP2
TP8
TP11
U1
U2
PAGE1
TP12
TP6
TP16
TP24
TP9
TP53
TP29
TP10
TP48
TP47
TP5
TP25
TP18
TP31
D10
D603
Q10
Q30
Q6
Q28
Q7
Q606
Q601
Q29
Q20
Q604
Q5
Q1
Q4
R97
TP17
TP13
D608
D6
C126
C62
C64
C66
C67
C659
C35
C78
C4
C86
C9
C77
C145
C41
C5
C52
C8
C6
C661
C1
C12
C22
C10
C11
C669
C21
C176
C34
C32
C142
C141
C42
C192
C177
C25
C33
C36
C31
C171
C28
C26
C132
C7
R49
R55
R71
R70
R7
R659
R68
R95
R73
R35
R34
R72
R104
R82
R14
R16
R21
R13
R10
R84
R11
R637
R648
R632
R96
R23
R647
R24
R63
R66
R81
R107
R665
R28
R631
R26
R92
R80
R25
TP33
TP66
TP15
TP74
TP34
TP38
TP37
TP22
TP75
TP70
TP68
TP65
TP35
TP36
TP72
TP71
TP73
TP79
TP78
TP69
TP55
TP45
TP44
TP43
TP58
TP62
TP61
TP57
TP56
TP51
C85
C670
C666
C23
C693
C38
C59
C63
C65
C72
C665
C194
C193
C40
C60
C84
C47
C82
C18
C24
C27
C43
C656
C37
C13
C17
C16
C14
C68
C48
C53
C124
C95
C121
C688
C668
C39
C190
C94
C75
C106
C107
C108
C109
C103
C105
C162
R19
R18
R108
R20
R75
R79
R678
R76
R78
R691
R690
R1
R2
R30
R682
R27
R102
R103
R15
R94
R3
R32
R36
R633
R77
R52
R64
R38
R22
R8
C73
C74
C46
C96
C51
C50
C15
C81
C123
R46
R47
R58
R37
R639
R646
R635
R642
R644
R6
R638
R29
R5
R86
R61
R39
TP67
TP76
TP77
TP3
KX-TG1070 CIRCUIT BOARD (Base Unit (Flow Solder Side View))
37
KX-TG1070HGB/KX-TGA107EXB
12.2. Circuit Board (Base Unit_Page key)
12.2.1. Component View
TP1
KEY1
TP2
KX-TG1070 CIRCUIT BOARD (Base Unit_page key (Component View))
38
KX-TG1070HGB/KX-TGA107EXB
Memo
39
KX-TG1070HGB/KX-TGA107EXB
12.3. Circuit Board (Handset)
12.3.1. Component View
C1
C2
C10
C49
C12
C11
COB1
C25
C20
C37C40C42C69
C68
C13
C14
C18
C16
C15
C38
C24
C147
C56
C59R52
C57
C55
C58
C72
C7
C8
C26
C19
C45
C44
C36
C71
C22
C27
C65
C30
C80
C33
C78
C90
C89
C52
C85
C74
C41
C43
C73
C76
C35
C77
C48
C39
C83
C91
C17
C87
C23
C4
C70
C9
C82
C64
C66
C63
R32
R30
R5
R33
R31
R24
R4
R95
R22
R94
R54
EC2
EC6
EC4
EC1
BUZ1
EC19
EC26
EC8
R42
R43
R110
R8
R6
R7
R44
R45
R49
R59
R34
R18
R9
R23
R3
R12
R13
R62
R60
R14
R56
R47
FIL1
R2
R10
R27
L1
Y1
U1
U4
RF
U3
Z2
Z3
L2
TP2
ANT1
TP14
TP125
TP110
TP111
TP126
> EP-GW <
PbF
35-006057-005-200
TP8
TP10
TP103
TP101
TP5
TP154
TP104
TP105
TP155
TP149
TP144
TP147
TP12
TP145
TP118
TP16
TP119
TP124
TP123
TP151
TP1
TP127
TP142
TP130
TP150
TP141TP143
TP121
TP140
TP137
TP129
TP128
TP156
TP114
TP115
TP117
TP27
TP4
TP108
TP131
TP135
TP11
TP7
TP152
TP136
TP29
SL7
SL8
SL3
SL4
SL2
SL5
SL6
SL1
TP15
TP43
TP109
TP153
TP113
D10
D4
D1
C84
D5
Q1
Q5
Q9
Q4
Q2
Q3
Q7
Q20
Q8
Q10
U2
Q6
C28
C75
C6
C88
C157
SPK1
SPK2
C54
C81
C62
C61
C79
C46
C60
C29
C53
C50
C51
C5
C67
C3
C21
C32
C34
C47
C31
R58
R28
R37
R39
R29
R48
R38
R11
R16
R19
R21
R20
R46
R35
Z1
R50
R53
R1
R15
R41
R61
R40
R26
L3
TP13
TP120
TP148
TP116
TP102
TP9
TP146
TP6
TP138
TP139
TP3
TP132
TP133
TC5
TP134
TP26
TP21
TP25
TP24
TP23
TP20
TP112
TP18 TP19
D6
D3
KX-TGA107 CIRCUIT BOARD (Handset (Component View))
40
KX-TG1070HGB/KX-TGA107EXB
12.3.2. Flow Solder Side View
KX-TGA107 CIRCUIT BOARD (Handset (Flow Solder Side View))
2
U7
FM7
FM4
FM5
1
U6
TP22
PbF
TP44
TP17
TP38
TP39
TP40
TP36
TP35
TP34
TP33
TP32
TP28
TP30
TP42
K13 K6 K27
K20 K4 K21
K2 K19 K10
K25 K5 K3
K24 K12 K16
K23 K11 K15
K22 K1 K7
> EP-GW <
35-006057-005-200
41
KX-TG1070HGB/KX-TGA107EXB
13 Exploded View and Replacement Parts List
1. RTL (Retention Time Limited)
Note:
The marking (RTL) indicates that the Retention Time is limited for this item.
After the discontinuation of this assembly in production, the item will continue to be available for a specific period of time.
The retention period of availability is dependant on the type of assembly, and in accordance with the laws governing part
and product retention. After the end of this period, the assembly will no longer be available.
2. Important safety notice
Components identified by the mark indicates special characteristics important for safety. When replacing any of these com-
ponents, only use specified manufacture’s parts.
3. ISO code (Example: ABS-94HB) of the remarks column shows quality of the material and a flame resisting grade about plas-
tics.
Note:
(*1) You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
F
KXTG1070HGB
KXTGA107EXB
Ref. No. Part No. Part Name & Description Remarks
A1 PQZBG1070HGB BASE UNIT (RTL)
A2 PQZHGA107EXB HANDSET (RTL)
A3 PQWATG1070CE AC ADAPTOR
A4 PQQX15480Z INSTRUCTION BOOK (*1)
A5 8060094500 LID, BATTERY COVER ASS'Y ABS-HB
9

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